Advances in Joining of Ceramics, Volume 138

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36 Advances in Joining of Ceramics and Cu/Si0 2 ) were also performed in order to suggest that the metal/ceramic bonding process can be controlled by the growth of the area chemically bonded, if the bonding was done under a proper condition of high temperature and high vacuum or a proper metalization for ceramic surfaces treated before bonding. 05 pm), compared with the surface of metals (Cu, Ni and Ti). Valence Auger analysis across the bond-interface was carried out to examine the atomic interaction between metal and ceramics 2» 10>.

47. D. Case and M. A. Crimp, "Joining of Ceramic Materials Using Spin on Interlayers", Advanced Engineering Materials, 3: 395-399, 2001. 48. Zeng, M. A. Crimp and E. D. Case, "The interfacial microstructure of Zirconia and MaCor™ joined using spin-on interlayers", Materials Science and Engineering, A307: 74 - 79,2001. 49. G. Lee and E. D. Case, "Joining of Non-Oxide Ceramics Using Conventional and Microwave Heating", 21 [4]: 589 - 597, Ceramic Engineering and Science Proceedings, American Ceramic Society, 2000.

Finite Element Analysis of Thermal Residual Stresses at Graded Ceramic-Metal Interfaces. Part 2. Interface Optimization for Residual Stress Reduction", J\ Appl Phys. 74 (2) p. 1321 (1993). 3 R. D. Torres, I. E. Reimanis, J. J. Moore, and G. W. Mustoe. "Design and Synthesis of Functionally Graded Composites: The TiB2/NiAl System", in Processing & Design Issues in High Temperature Materials, edited by N. S. Stolloff and R. H. Jones, The Minerals, Metals & Materials Society, Warrendale, PA (1997).

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